SPTS获得CEA-Leti 300mm PVD新订单

 **的等离子刻蚀、淀积和热处理设备供应商SPPProcessTechnologySystems（SPTS）宣布获得了来自CEA-Leti的SigmafxP物理气象淀积（PVD）系统的订单。该300mm系统将在Leti新启动的300mm晶圆厂内用于通孔硅（TSV）技术的开发。

    

    SPTSWinsNew300mmPVDOrderfromCEA-Leti

    

    FrenchResearchInstituteToDeploySigma?fxPTMPhysicalVaporDepositionSystemInNewly-Inaugurated3D-ICFacility

    Newport,UnitedKingdom—9February,2011—SPPProcessTechnologySystems(SPTS),aleadingmanufacturerofplasmaetch,deposition,andthermalprocessingequipmentforthesemiconductorindustrytodayannouncedithasreceivedafollowonpurchaseorderfromCEA-LetiforitsSigma?fxPTMPhysicalVaporDeposition(PVD)system.The300mmsystemwillbeusedforadvancedThrough-Silicon-Via(TSV)developmentatLeti’snewly-inaugurated300mmfabextensioninGrenoble,France.ThissystemwincomesontheheelsofanOctober2010agreementbetweenLetiandSPTStocollaborateoncreatingnext-generationhighaspectratioTSVs.ThenewSigmasystemwilljoinSPTS’siliconetchanddielectricdepositionsystemspreviouslyselectedforthisnewline.

    Leti’sstate-of-the-artintegrationlinefeaturesacompletesuiteoftheequipmentrequiredforresearchanddevelopmentonadvanced3D-ICsingleprocessesandintegration.TheSigmafxPwilldepositthediffusionbarrierandseedmetallayerspriortothefinalCuelectroplatingviafillprocess.UsingSPTSAdvancedHi-Fill(AHF)technology,ionizedPVDdepositiontechniqueswillmaximizemetalcoverageinthevia,creatinganenvironmentforcost-effectiveviafillfinhighaspectratioarchitectures

    “WeareworkingcloselywithSPTSonnext-generation3D-ICdevelopments,andtheirmetaldepositioncapabilityformsanintegralpartofourd