“SPTSisextremelyexcitedtohavebeenselectedastheetch,dielectricandmetaldepositionpartnerinCEA-Leti’s3D-ICdevelopmentline,”saidKevinT.Crofton,executivevicepresident,andmanagingdirectoroftheSingleWaferDivisionatSPTS.“BeingoneoftheearlydevelopersofintegratedTSV,ourteamiscommittedtoensuringtheproject’ssuccessthroughourcumulativeexpertise.”
Commentingontheinaugurationofthe3DIntegrationLine,SusumuKaminaga,chairmanofSPTSandpresidentofSumitomoPrecisionProducts(SPP)said,“SPTShasbeencloselyassociatedwithTSVresearchanddevelopmentwithLeti,andweareproudtobeachosenpartnerforthisimportantmilestone.”
SPTSparticipatedatLeti’sInaugurationDayactivitiesinJanuary,andpresentedonfutureTSVtrendsandtechnicalrequirementsinadvanced3D-ICmanufacturing.